The optimal low-pressure molding material for encapsulating automotive electronic components: "Bioglass."
Supports mass production of automotive components with environmental resistance, heat dissipation, and fast curing. Contributes to reducing defects and improving production efficiency through low-pressure sealing.
In automotive electronic components used in harsh environments, reliability and mass production capability are emphasized. "Biloglass" is a thermosetting dry molding material that achieves both rapid curing and low-pressure sealing, allowing for reduced tact time without post-curing. It also supports small devices and insert molding, contributing to reduced production costs. 【Features】 - Thermal cycle resistance - High-speed curing - Heat dissipation & insulation - Low-pressure sealing / high filling capability - No additional heat treatment required *For more details, please refer to the PDF document or feel free to contact us.
- Company：三菱ガス化学ネクスト（旧日本ユピカ） 本社
- Price：Other
